One of our core technologies is the integration of semi-conductor chips into the core of yarns. A key feature of most textiles is that the textile yarns are held together by interlocking rather than bonding. This enables fabrics to shear in a scissor-like manner as well as bend. The ability to shear is the reason textile fabrics are flexible and can conform to the required shape, and is one of the main reasons they are used. If electronics are to be fully integrated into textiles it is essential that these textile characteristics are retained. The best way of achieving this is to integrate electronic functionality into yarns that can then be formed into fabrics using traditional yarn interlocking techniques such as knitting and weaving. The chips we are embedding within the fibres of yarns are very small. As a illustration, the picture shows one of the chips we are using photographed among some grains of salt.
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